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GE Fanuc IC695ETM001 RX3i Ethernet Module
GE Fanuc IC695ETM001 RX3i Ethernet Module
Technical Specifications:
Manufacturer:
GE
Product No.:
IC695ETM001
Condition:
In Stock
Product Type:
Ethernet Module
Product Origin:
USA
Weight:
300g
Shipping port:
Xiamen
Warranty:
12 months
GE Fanuc IC695ETM001 RX3i Ethernet Module Specifications and Description
The IC695ETM001 RX3i Ethernet Module is a high-performance communication module designed to provide Ethernet connectivity for the PACSystems RX3i controller. It features two RJ-45 ports with a built-in switch, allowing for flexible networking configurations. This module supports multiple communication protocols, enhancing its versatility in various industrial applications.
Technical Specifications
- Product Name: PACSystems RX3i Ethernet Module
- Model Number: IC695ETM001
- Lifecycle Status: Active
- Module Type: Ethernet
- Backplane Support: Universal Backplane Only (Uses PCI Bus)
- Number of Slots Occupied on Backplane: 1
- Protocol Support: SRT, Ethernet Global Data (EGD), Channels (Client and Server), Modbus TCP (Client and Server)
- Entity Type: Client/Server
- Communication Ports: Two RJ-45 ports, one MAC Address
- Bus Speed: 10/100 Mbaud
- Network Distance: Network Dependent
- Bus Diagnostics: Yes
- Number of Drops Supported: Network Dependent
- Connector Type: Two RJ-45
- Internal Power Used: 840 mA @ 3.3 VDC; 614 mA @ 5 VDC
Features and Benefits
- Versatile Communication Protocols: The IC695ETM001 supports SRT, Ethernet Global Data (EGD), Channels (both Client and Server), and Modbus TCP (both Client and Server), making it suitable for a wide range of industrial communication needs.
- Built-in Switch: The two RJ-45 ports come with a built-in switch, simplifying network connections and reducing the need for external networking hardware.
- High Performance: With a bus speed of 10/100 Mbaud, this module ensures fast and reliable data transfer within the industrial network.
- Compact Design: Occupying only one slot on the backplane, the IC695ETM001 provides high functionality while maintaining a compact form factor.
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