T8310C | Rockwell ICS Triplex Trusted Expander Module

Trusted Expander Modules (XIM / XPM) Specifications

Power Supply Requirements

• Backplane (IMB) Supply: 20 Vdc to 32 Vdc
• Field Supply: N/A
• Power Dissipation: 45 W Backplane Supply

Module Location

• Module Location: T8300 Expander Processor Slot

Isolation and Fusing

• Isolation: 50 V Basic Insulation, Module to Backplane Supply
• Fusing: Not User Serviceable

Expander Communication Distance

• Using TC-301 copper cable: 30 m
• Using T8314 Fibre TX/RX Units: 10 km

Temperature and Humidity

• Operating Temperature: 0 °C to +60 °C (+32 °F to +140 °F)
• Storage Temperature: -25 °C to +70 °C (-13 °F to +158 °F)
• Relative Humidity - Operating and Storage: 10 % – 95 %, non-condensing

Dimensions and Weight